3M™ Trizact™ Pad Conditioner

  • 3M ID B5005049057

3D microreplicated structures help manufacturers deliver precision and control for unique requirements

Diamond coated ceramic material can be manufactured to key specifications for maximum yield and pad life

Metal-free cutting surface for advanced node processes sensitive to metal contamination

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Details

Hoogtepunten
  • 3D microreplicated structures help manufacturers deliver precision and control for unique requirements
  • Diamond coated ceramic material can be manufactured to key specifications for maximum yield and pad life
  • Metal-free cutting surface for advanced node processes sensitive to metal contamination
  • Outstanding disk-to-disk consistency for predictive performance
  • Compatible with all 3M™ CMP Pad Conditioner Coatings with minimal process changes
  • Combine with 3M™ CMP Pad Conditioner Coatings for additional protection from metal contamination

3M™ Trizact™ Pad Conditioner delivers precision, consistency and reliability to semiconductor chemical mechanical polishing (CMP). The diamond-coated ceramic construction on 3M™ Trizact™ Pad Conditioner is ideal for manufacturing to micro-scale specifications, as well as exceptionally smooth pad surface finishes without tiny scratches commonly caused by diamond grit abrasives. It has a metal-free cutting surface for advanced node processes sensitive to metal contamination. It can also be combined with 3M™ CMP Pad Conditioner Coatings to help reduce metal leaching by up to an additional 99% while maintaining flatness, aggressiveness and polishing performance.

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